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Lecture3 Chapter2 - Positive and Negative Logic

This document discusses positive and negative logic, integrated circuits, and digital logic families. It defines positive and negative logic and shows logic gates in both formats. It describes how integrated circuits are constructed and levels of integration from SSI to ULSI. Finally, it outlines common digital logic families like TTL and CMOS and compares their characteristics like fan-out, propagation delay, and noise margin.
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0% found this document useful (0 votes)
52 views

Lecture3 Chapter2 - Positive and Negative Logic

This document discusses positive and negative logic, integrated circuits, and digital logic families. It defines positive and negative logic and shows logic gates in both formats. It describes how integrated circuits are constructed and levels of integration from SSI to ULSI. Finally, it outlines common digital logic families like TTL and CMOS and compares their characteristics like fan-out, propagation delay, and noise margin.
Copyright
© © All Rights Reserved
Available Formats
Download as PDF, TXT or read online on Scribd
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Chapter2: Boolean Algebra and Logic

Gates
Lecture3- Positive and Negative Logic
Engr. Arshad Nazir, Asst Prof
Dept of Electrical Engineering
EE-223 Digital Logic Design Spring 2024 SEECS 1
EE-223 Digital Logic Design Spring 2024 2
Objectives
• Study Positive and Negative Logic
• Integrated Circuits
• Digital Logic Families
• Problem Solving Session

EE-223 Digital Logic Design Spring 2024 3


Positive and Negative Logic
• Binary signals in a circuit can have one of two values.
➢ One signal represents logic-1 and the other logic-0.
• A circuit input or output will hold either a high or low signal.
➢ Choosing the high level, H, to represent logic-1 is called a positive
logic system.
➢ Choosing the low level, L, to represent logic-1 is called a negative
logic system

EE-223 Digital Logic Design Spring 2024 4


Positive and Negative Logic gates

EE-223 Digital Logic Design Spring 2024 5


Integrated Circuits
• An integrated circuit (IC) is a silicon semiconductor crystal, called a
chip, containing the electronic components for constructing digital
gates.
➢ Gates are interconnected within the chip to form the required
circuit
➢ The IC is housed inside a ceramic or plastic container with
connections welded to external pins
➢ There can be 14 to several thousand pins on a chip
➢ Each IC has a numeric designation printed on the surface for
identification. The number can be looked up in catalogs (paper
and electronic) that contain descriptions and information about
the IC

EE-223 Digital Logic Design Spring 2024 6


Levels of Integration
• ICs are categorized by the number of gates that they contain in them:
➢ Small-scale integration (SSI) devices contain several (usually less than 10)
independent gates in a single package. Early 60’s
➢ Medium-scale integration (MSI) devices include 10 to 1000 gates in a single package,
used to perform elementary digital operations. Late 60’s
➢ Large-scale integration (LSI) devices contain thousands of gates in a single package,
used in processors, memory chips, and programmable logic devices. Mid 70’s
➢ Very Large-scale integration (VLSI) devices contain hundreds of thousands of gates in
a single package, used in large memory arrays and complex microcomputer chips.
80’s
➢ Ultra Large-scale integration (ULSI) devices contain millions of gates in a single
package. 90’s and 00’s
➢ Giga-scale integration (GSI) devices contain hundreds of millions of gates in a single
package.
➢ Tera-scale integration (TSI) devices contain millions of millions of gates in a single
package.
EE-223 Digital Logic Design Spring 2024 7
Digital Logic Families
• ICs are also classified by the specific circuit technology (digital logic
family) that they belong to:
➢ Transistor-transistor logic (TTL) is a standard.
➢ Emitter-coupled logic (ECL) is used in high-speed operation.
➢ Metal-oxide semiconductor (MOS) is used for high component
density.
➢ Complementary metal-oxide semiconductor (CMOS) is used in
low power consumption.
➢ Diode-Transistor Logic (DTL) being obsolete not used these days.
➢ Resistor-Transistor Logic (RTL) not used these days.

EE-223 Digital Logic Design Spring 2024 8


Logic Family Characteristics
• Digital logic families are usually compared by the following
characteristics:
➢ Fan-out specifies the number of standard loads that the output of
a gate can drive without impairing its normal operation or it
specifies the amount of current that an output needs to drive
many input pins on other gates.
➢ Fan-in is the number of inputs available in a gate.
➢ Power dissipation is the power consumed by the gate.
➢ Propagation delay is the average delay time for the signal to
propagate from input to output.
➢ Noise margin is the maximum external noise voltage added to an
input signal that does not cause an undesirable change in the
circuit output.
➢ Reliability is the long-term success factor of the IC.
EE-223 Digital Logic Design Spring 2024 9
Integrated Circuits Design
• Why is it better to have more gates on a single chip?
➢ Easier to build systems
➢ Less power consumption
➢ Higher clock frequencies
• What are the drawbacks of large circuits?
➢ Complex to design
➢ Chips have design constraints
➢ Need tools to help develop integrated circuits
• Need tools to help develop integrated circuits
➢ Computer Aided Design (CAD) tools
➢ Automate tedious steps of design process
➢ Hardware description language (HDL) describe circuits
EE-223 Digital Logic Design Spring 2024 10
The End

EE-223 Digital Logic Design Spring 2024 11

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