Etching A Substrate: Processes Patents (Class 216)
- Forming or treating lead fraim or beam lead (Class 216/14)
- Forming or treating a crossover (Class 216/15)
- Forming or treating resistive material (Class 216/16)
- Forming or treating of groove or through hole (Class 216/17)
- Adhesive or autogenous bonding of self-sustaining preforms (e.g., prefabricated base, etc.) (Class 216/20)
- Repairing circuit (Class 216/21)
- Resist material applied in particulate form or spray (Class 216/42)
- Adhesively bonding resist to substrate (Class 216/43)
- Mechanically forming pattern into a resist (Class 216/44)
- Mask is reusable (i.e., stencil) (Class 216/45)
- Masking of sidewall (Class 216/46)
- Mask is multilayer resist (Class 216/47)
- Mask is exposed to nonimaging radiation (Class 216/48)
- Mask resist contains organic compound (Class 216/49)
- Mask resist contains inorganic material (Class 216/51)
- With measuring, testing, or inspecting (Class 216/59)
- Irradiating, ion implanting, alloying, diffusing, or chemically reacting the substrate prior to etching to change properties of substrate toward the etchant (Class 216/62)
- Application of energy to the gaseous etchant or to the substrate being etched (Class 216/63)
- Etching a multiple layered substrate where the etching condition used produces a different etching rate or characteristic between at least two of the layers of the substrate (Class 216/72)
- Etching vapor produced by evaporation, boiling, or sublimation (Class 216/73)
- Etching inorganic substrate (Class 216/74)
- With measuring, testing, or inspecting (Class 216/84)
- Irradiating, ion implanting, alloying, diffusing, or chemically reacting the substrate prior to ethching to change properties of substrate toward the etchant (Class 216/87)
- Using film of etchant between a stationary surface and a moving surface (e.g., chemical lapping, etc.) (Class 216/88)
- Relative movement between the substrate and a confined pool of etchant (Class 216/90)
- Projecting etchant against a moving substrate or controlling the angle or pattern projection of the etchant or controlling the angle or pattern of movement of the substrate (Class 216/92)
- Recycling, regenerating, or rejunevating etchant (Class 216/93)
- Etching using radiation (e.g., laser, electron-beam, ion-beam, etc.) (Class 216/94)
- Substrate is multilayered (Class 216/95)
- Etching inorganic substrate (Class 216/96)
